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| 简介 |
本型号产品采用陶瓷工艺与半导体工艺相结合的工艺技术制作而成，为两端轴向引出线玻璃封装结构。
This model is manufactured by applying the technique combining
ceramic process and semicorductor process, featuring an enclosed
glass structure with axial leadout at both ends. |
| 特点
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稳定性好，可靠性高
 阻值范围宽、阻值精度高
由于采用玻璃封装，可在高压和高湿等恶劣环境下使用
体积小，重量轻，结构坚固，便于自动化安装（在硬制线路板上）
热感应速度快，灵敏度高
Characteristic
Optimal
stabiliy and reliability
Wide
range and high precise of resistance value
Suitable
for harsh environment with cxtremely high temperature and humidity
due to enclosed glass structure.
Easy
to install aulomatically due to compact, light and robust structure
Rapid
heat induction and high sensitivity |
| 应用 |
家用电器（如空调机、微波炉、电风扇、电取 暖炉等）的温度控制与温度检测
办公自动化设备（如复印机、打印机等）的温度检测或温度补偿
工业、医疗、环保、气象、食品加工设备的温度控制与检验
液面指示和流量测量
手机电池
仪表线圈、集成电路、石英晶体振荡器和热电偶的温度补偿
Application
Temperature
control and detection of home appliance (for example air conditioning,
microwave oven, electric fan, electric warming stove, etc.)
Tenperaturc
control and detection of automatic office devices (for example
copier, printer, etc.)
Temperature
control and detection of equipment applied in industry, medical
treatment, envil-onmental protection, aerography, food processing
etc.
Level
indication and flow measurement
Cells
used in mobile phone
Temperature
compensation of instrument coil, integrated circuit, quartz
crystal oscillator and thermocouple. |
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